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Automotive

Overview

  • - HDI technology is required with the increasing use of mobile chip sets according to the application of communications technology to electronic equipment.
  • - HDI PCB processing capacity secured is secured for 1.6T or thicker plates.
  • - High reliability compared to mobile demanded.

Feature

  • - High Reliability (Low CTE, Anti CAF)
  • - 3-N-3 Stack Via – Via On Pad Process
  • - Impedance Control

Application

Specification

Specification
Item Specification
Layer / Thick. 10L / 1.6mm
Core / Dielectric 60㎛ / 40㎛, 50㎛, 60㎛, 70㎛
Line / Space 50㎛ / 50㎛
LVH / PAD 100㎛ / 230㎛
BGA / Pitch 250㎛ / 400㎛
Finish ENIG

Overview

  • Radar Module is an advanced driving assistance system that detects all surrounding situations to prevent collision when driving ahead or at side/back, regardless of the surrounding environment, and provides a solution that can process high-frequency signals at 24GHz or higher.

Feature

  • Low Dk / Df Materials
  • - Teflon material drilling process and plating technology.
  • - Bonding of Teflon + FR-4 CCL.
  • - BVH layering process.
  • - Cavity insertion.

Application

Specification

Specification
Item Specification
Layer / Thick. 8L / 1.0mm
Core / Dielectric 100㎛ / 100㎛
Line / Space / Error 130㎛ / 100㎛
Materials Teflon + FR-4
Finish ENIG

Overview

  • - Increasing demand for automotive electronic parts.
  • - Requires higher level of guaranteed reliability compared to mobile.
  • - Secured copper plating and heavy CU processing capacity.

Overview

  • - black box
  • - Navigation

X-section

Feature

Feature
Item Specification
Pixel 2 ~ 5MP
Thickness 0.8 ~ 1.6T (2~6L)
plating 25 ~ 35㎛
Cu Thickness 1 ~ 2Oz
Finish Tin / ENIG
Reliability Thermal shock / Thermal cycle

Overview

  • - Requires high reliability between substrates for the electronic systems for automobiles.
  • - Integrated PCB secures excellent reliability compared to connector type.
  • - Secures excellent thermal/electrical reliability compared to symmetric structure.

Application

  • - Automotive ECU & Fuse Box
  • - Automotive Sensor & Camera Module

Specification

Specification
Division MP R&D
Structure Rigid-Flex Semi-Flex
Material Rigid FR-4 FR-4
Flex PI
Line / Space 50/50㎛ 35/35㎛
Line / Space OSP, ENIG/Hard Au
Thickness Max 1.6㎜
Reliability (Thermal Cycle) > 1000 cycles > 2000 cycles

Overview

  • - Extends lifespan of parts with by radiating heat for High Power & Heat radiation Module.
  • → LED : High Power LED …
  • → Automotive : DC-DC Converter …

Feature

  • - High Heat radiation → Thermal Via prepared (Min 10℃ ↑) Excellent heat dissipation characteristics
  • - Conventional PCB Structure→ PTH, Build-Up PCB Applicable to the structure

Application

  • - High Power & Heat radiation Module Heat dissipation characteristics corresponding to the required part life extension
  • → LED : High Power LED …
  • → Automotive : DC-DC Converter …

Specification

Specification
Item Specification
Layer / Thick. ≤8L / 1.6T
Core / Dielectric 150㎛ / 200㎛
Line / Space 150 / 150㎛
PTH/PAD 300㎛ / 550㎛
Finish ENIG

Overview

  • - Reliability of electronic parts has increasing importance with the convergence of IT technology and the Safety and Intelligence division of electronic systems.
  • - Optimum production systems securing high reliability.

Feature

  • - High Reliability( High Thermal Conductivity, Hi-Tg Low CTE , Heavy Copper )
  • - Heat-sinks / Press Fit Technology
  • - RF/High-performance materials

Application & Specification

  • 1. Lane Breakaway Warning

    - Automatically inform driver of invading lane.

  • 2. Adoptive Cruise Control

    - Automatically operated in case of low speed vehicle being in front

  • 3. Dead Angel Sensing

    - Driver can be aware of following vehicle by micro camera in mirror.

  • 4. Moving Light System

    - Automatically change lighting direction as steering turns.

  • 5. Exterior Airbag System

    - Relief the impact of pedestrian.

  • 6. Electronics Stability Program

    - Electronically control engine & 4 wheel brakes.

  • 7. Auto Parking System
  • 8. Next Generation GPS

    - Provide Driver with necessary information during driving.

  • 9. Notice Dozing off System

    - Observe driver’ s blink & pupil.

  • 10. Night Vision System

    - Secure clear night vision through the infrared device.

Specification

Specification
Division A Class B Class C Class C+ Class
Application Standard Engine Room Engine Mounted
Thermal Cycle -40℃,30min

85℃,30min
500Cycle
-40℃,30min

105℃,30min
500Cycle
-40℃,30min

125℃,30min
500Cycle
-40℃,30min

125℃,30min
1000Cycle
Hot Storage 85℃ / 500Hr 105℃ / 500Hr 125℃ / 500Hr 125℃ / 1000Hr
Development
History
Hard O O O O
Flex O O O O
M/F - - O O
R/F O O O O
Division D Class D+ Class E Class E+ Class
Application Power Train
Thermal Cycle -40℃,30min

140℃,30min
500Cycle
-40℃,30min

140℃,30min
1000Cycle
-40℃,30min

160℃,30min
500Cycle
-40℃,30min

160℃,30min
1000Cycle
Hot Storage 140℃ / 500Hr 140℃ / 1000Hr 160℃ / 500Hr 160℃ / 1000Hr
Development
History
Hard O O R&D
Flex O O O O
M/F O R&D
R/F O O R&D