home PRODUCT Wearable

Wearable

Overview

  • - Integrated R/F PCB high-density circuits required for compact/functional Smart watches.

Feature

  • - High density build-up structure
  • - Any layer stack via available

X-section

TRM

TRM
Item 2015 2016
Layer R/F 10L or higher R/F 10L or higher
Structure 3-N-3, Any layer Any layer
Min L/S 40/40㎛ 30/30㎛
Thickness 0.65T 0.5T
PSR clearance 30㎛ 25㎛

Overview

  • - Integrated PCB high-density circuits required for compact/lightweight/functional Smart bands.
  • - Multi structure for bending characteristics.

Feature

  • - High density build-up structure
  • - skip via available

X-section

TRM

TRM
Item 2015 2016
Layer M/F 4L M/F 4L
Structure Skip via, Stack via Any layer
Min L/S 40/40㎛ 30/30㎛
Thickness 0.20T 0.15T

Overview

  • - Various structures of cavity PCB are adopted for C/M as mobile equipment design has met a limitation.
  • - Fine circuit design required for Any layer and Cu direct with high-design circuit design.
TRM
Item Specification
Pixel 16MP or higher
Layer 4 ~ 6L Any layer, cavity
Thickness 0.4mm(total) / 0.2mm(cavity) or lower
Min L/Ss 40/55㎛
LVH Φ0.075㎛

Application

  • - Camera module
  • - Wearable

Sample

Sample

Overview

  • - Pre-preg or bonding sheets are excluded using one-sided FCCL and bonded materials.
  • - Suitable for thin plates and saves man-day.

Feature

  • - thin FPC : 0.22T (4L)
  • - reduce PCB process (mold / hot press)

TRM

TRM
Item Rigid Flex CuCL
SMT area Flex area SMT area Flex area
Total Thickness 4-2-4 0.30T 0.12T 0.22T 0.12T
6-4-6 0.55T 0.27T 0.40T 0.27T
6-4-6 0.55T 0.12T 0.40T 0.12T
Line / Space 50 / 50㎛
PTH / Land 120 / 300㎛
LVH / Land 100 / 250㎛