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HDI

Overview

  • - Smart phone 및 Tablet PC의 다기능 소형화 실현을 위한 all layer stack 및 micro via 적용

Feature

  • - 10&12L Any Layer Stack VIA (Via on Pad process)
  • - Copper Direct LVH (via fill) process
  • - Fine Pattern & Slim HDI
  • - Status of GDS : Mass

Specification

재무상태표
Item Specification
Layer / Thick. 10L / 0.6mm & 12L / 0.65mm
Core / Dielectric 60㎛ / 35㎛
Line / Space 30㎛ / 40㎛
Material H/F, Low Dk
LVH (Via fill) 80um
Finish ENIG

Overview

  • - Smart phone의 다기능, ultra 슬림화를 위한 all layer stack micro via 및 fine pattern 적용

Feature

  • - 12L Any Layer All Stack Via (Via on Pad process)
  • - Copper Direct LVH (via fill) process
  • - Fine Pattern & Ultra Slim HDI
  • - High Registration
  • - mSAP (Modified Semi Additive Process)

Application

Ultra Slim Smart Phone

Specification

재무상태표
Item Specification
0.4 Pitch 2 Trace 0.35 Pitch 2 Trace

0.4 Pitch 3 Trace

Layer / Thick. 10L / 0.60mm 12L / 0.65mm 12L / 0.65mm
Core / Dielectric 0.065mm / 40um 0.065mm / 35um 0.065mm / 35um
Line / Space 40um / 40um 30um / 40um 30um / 30um
LVH / PAD 80um / 180um 90um / 170um 90um / 170um
BGA / Pitch 230um / 400um 200um / 350um 250um / 400um
Material H/F H/F H/F

Overview

  • - 미세회로 및 VIA로 구성된 대형 LED Display용 고밀도 PCB

Feature

  • - 8L BUM D type
  • - VIAFILL process

Application

실내용 Large Format Display

Specification

재무상태표
Item Specification
Layer / Thick. 8L / 1.6mm
Line / Space 60um / 70um
Laser VIA 100um
QFP Pitch 400um
PSR Black
Finish OSP